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Multiplexing a 1-Wire host, AI-driven EDA momentum, PCB inspection challenges, Embedded World coverage, more

Embedded system design highlights, resources and insights

 

View this newsletter online
April 3, 2024
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Multiplexing a 1-Wire host across multiple channels

1-Wire networks with many 1-Wire nodes can require dedicated 1-Wire channels. This article discusses a method for using only one 1-Wire host in a network while having numerous 1-Wire channels.

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Synopsys SNUG: AI driven EDA momentum, new tools for multi-die

Synopsys highlighted momentum its ai suite which includes DSO.ai and VSO.ai, and introduced 3DSO.ai to enable 3D design space optimization for multi-die systems, plus new hardware-assisted verification solutions and access to a new cloud hybrid system.

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How miniaturization impacts PCB inspection

Smaller device form factors often bring PCB design challenges that can subsequently affect inspection. 

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Nvidia GTC: NIM microservices will drive more generative AI copilots

NIMs enable users to create and deploy custom applications on their own platforms and retain full ownership of their IP. Built on top of CUDA, a catalog of cloud-native microservices is available Nvidia and its partners.

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Rohde & Schwarz to show measurements on novel Bluetooth Channel Sounding signals

The Bluetooth Channel Sounding feature will enable unprecedented positioning accuracy for consumer and commercial applications. Rohde & Schwarz will demonstrate signal measurement capabilities to support chip and device development.

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Ambiq launches SoC for running AI/ML on batteries

Ambiq said combination of performance and efficiency enables its customers to deploy sophisticated speech, vision, health, and industrial AI models on battery-powered devices everywhere.

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More from Embedded

Educational Resources

From the AspenCore News Network

EETimes

Solving the Challenges of Adding AI to Home Appliances

Taking the next step of deploying AI to our home devices is not as far away as one may think.

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Planet Analog

The double-fault is the debugging challenge

Debugging encompasses different cause-and-effect pairings, with varying levels of design challenge.

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EETimes

Proprietary Memories Are a High-Risk Endeavor

Non-standard memories tend to meet an early death, but customized devices have their role.

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EETimes

Exploring Wired Networks for Smart Pathways in Factories

Solving connectivity challenges will help facilitate more automated production in factories.

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EDN

Are ghiplets the next evolution stage in GPU designs?

Ghiplet has an inherent benefit for high-compute applications like AI: memory dies can be spread around the main GPU die.

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EETimes

Automotive Memory Trends, Software Virtualization, & Embedded Vision

In this embedded edge with Nitin podcast, we explore megatrends in memory and storage in automotive, virtualization and development tool support for automotive SoCs, and embedded vision, through interviews with Micron Technology, Green Hills Software, and e-con Systems. 

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